Of your ceramic. Researchers have already been working to enhance the joining between dissimilar materials by diffusion bonding. Barrena et al. [40] investigated the joining of Ti6Al4V to Al2 O3 by diffusion bonding utilizing as interlayer an Ag-Cu alloy (72 wt. Ag, 28 wt. Cu) having a thickness of 60 created by electron beam evaporation. The interface’s microstructure was composed of unique Ti-Cu phases and (Ag), and the shear tests showed a maximum of 140 MPa obtained at a temperature of 750 C along with a dwell time of 30 min. Yu et al. [10] joined Ti6Al4V to Ti2 SnC making use of Cu foil (50 ) as an interlayer in Ar atmosphere performed at a temperature of 750 C in the course of 60 min; a comparatively low temperature was allowed as a result of the destabilization of Ti2 SnC that happens below 700 C. The interface’s microstructure is formed primarily by Ti3 Cu4 and TiCu4 , and also the maximum value obtained in the shear tests was about 86 MPa [10]. Kliauga and Ferrante [41] joined Al2 O3 to AISI304 stainless steel applying a industrial Ti sheet with a thickness of 500 by diffusion bonding processed at 800 C for the duration of 180 min and at 900 and 1000 C in the course of 120 min beneath a pressure of 15 MPa in vacuum. The authors investigated the interfacial reaction items of Ti/Al2 O3 . The microstructure characterization on the surface fracture showed that the composition will depend on the temperature and dwell time. The joints developed at a temperature of 800 C for 180 min exhibit the Ti3 Al phase in the interface close for the Olesoxime Mitochondrial Metabolism titanium base material, whilst TiAl is observed around the ceramic side. Nonetheless, for joints obtained at 900 and 1000 C during 120 min, the interface is constituted only by Ti3 Al. In related operate, Travessa and Ferrante [42] diffusion bonded exactly the same base components and interlayer at 700 C for 120 min, and 800 C for 15 and 120 min. The experiments have been unsuccessful, and no reaction could be seen in the interface. Rocha et al. [43] joined pure Ti to Al2 O3 by diffusion bonding at 800 C for 90 min beneath a stress of 5 MPa. The characterization of the Ti/Al2 O3 interface identified the presence of TiAl adjacent to alumina and Ti3 Al adjacent to pure Ti. Furthermore, the authors applied galvanic corrosion tests to study the chemical degradation in the interfaces, plus the final results showed that the corrosion resistance was impaired by the TiAl phase. Through the joining of Ti to Al2 O3 , TiAl intermetallic phase constantly comes up in zones adjacent to alumina, along with the TiAl/Ti3 Al ratio can improve with all the thickness of your Ti interlayer [44]. While some works referred to low temperature bonding (75000 C), the development of new approaches must be investigated to cut down the formation of (Ag) at the interface, as will be the case when Ag-based alloys are utilized as interlayers. The presence of (Ag) is detrimental towards the service temperature and really should be avoided. The objective of the present Fmoc-Gly-Gly-OH supplier function consists in the study in the feasibility of joining Ti6Al4V to Al2 O3 by diffusion bonding applying titanium as interlayer material. Unique titanium interlayers had been investigated: Ti thin films deposited onto Al2 O3 base material by magnetron sputtering and freestanding Ti thin foils. The joints processed making use of Ti foilsMetals 2021, 11,3 ofhave a reduce processing price and are far more straightforward than those utilizing thin films obtained by magnetron sputtering. Nevertheless, the lack of adhesion in between the Ti foils and ceramics may make it tough to get sound joints. The Ti interlayer was chosen to.