In the ceramic. Researchers happen to be operating to improve the Olesoxime Data Sheet joining between dissimilar materials by diffusion bonding. Barrena et al. [40] investigated the joining of Ti6Al4V to Al2 O3 by diffusion bonding applying as interlayer an Ag-Cu alloy (72 wt. Ag, 28 wt. Cu) with a thickness of 60 produced by electron beam evaporation. The interface’s microstructure was composed of Distinct Ti-Cu phases and (Ag), as well as the shear tests showed a maximum of 140 MPa obtained at a temperature of 750 C plus a dwell time of 30 min. Yu et al. [10] joined Ti6Al4V to Ti2 SnC making use of Cu foil (50 ) as an interlayer in Ar atmosphere performed at a temperature of 750 C through 60 min; a relatively low temperature was permitted resulting from the destabilization of Ti2 SnC that occurs beneath 700 C. The interface’s microstructure is formed mostly by Ti3 Cu4 and TiCu4 , and also the maximum value obtained in the shear tests was about 86 MPa [10]. Kliauga and Ferrante [41] joined Al2 O3 to AISI304 stainless steel utilizing a industrial Ti sheet with a thickness of 500 by diffusion bonding processed at 800 C during 180 min and at 900 and 1000 C in the course of 120 min beneath a stress of 15 MPa in vacuum. The authors investigated the interfacial reaction items of Ti/Al2 O3 . The microstructure characterization of the surface fracture showed that the composition is determined by the temperature and dwell time. The joints produced at a temperature of 800 C for 180 min exhibit the Ti3 Al phase at the interface close for the titanium base material, whilst TiAl is observed on the ceramic side. Nonetheless, for joints obtained at 900 and 1000 C for the duration of 120 min, the interface is constituted only by Ti3 Al. In equivalent work, Travessa and Ferrante [42] diffusion bonded the identical base materials and interlayer at 700 C for 120 min, and 800 C for 15 and 120 min. The experiments have been unsuccessful, and no reaction may be seen at the interface. Rocha et al. [43] joined pure Ti to Al2 O3 by diffusion bonding at 800 C for 90 min below a pressure of five MPa. The characterization of your Ti/Al2 O3 interface identified the presence of TiAl adjacent to alumina and Ti3 Al adjacent to pure Ti. Furthermore, the authors applied Polmacoxib Biological Activity galvanic corrosion tests to study the chemical degradation from the interfaces, plus the benefits showed that the corrosion resistance was impaired by the TiAl phase. In the course of the joining of Ti to Al2 O3 , TiAl intermetallic phase normally comes up in zones adjacent to alumina, and the TiAl/Ti3 Al ratio can improve with the thickness on the Ti interlayer [44]. Despite the fact that some performs referred to low temperature bonding (75000 C), the improvement of new approaches need to be investigated to decrease the formation of (Ag) at the interface, as would be the case when Ag-based alloys are used as interlayers. The presence of (Ag) is detrimental towards the service temperature and needs to be avoided. The objective with the present operate consists inside the study on the feasibility of joining Ti6Al4V to Al2 O3 by diffusion bonding using titanium as interlayer material. Distinct titanium interlayers were investigated: Ti thin films deposited onto Al2 O3 base material by magnetron sputtering and freestanding Ti thin foils. The joints processed applying Ti foilsMetals 2021, 11,three ofhave a reduced processing cost and are far more simple than these applying thin films obtained by magnetron sputtering. Even so, the lack of adhesion involving the Ti foils and ceramics may well make it hard to get sound joints. The Ti interlayer was chosen to.