The diffusion bonding method. In-between the 2 OO3 and this interface layer, it can be doable to observe a thin layer ( 1 ) composed of alternated distinct grey layer, it is attainable to observe a thin layer (1 ) composed of alternated various grey columnar small grains. Nonetheless, it it was not attainable to perform EDS analyses owingits columnar little grains. However, was not possible to carry out EDS analyses owing to to lowered thickness. its lowered thickness.(a)(b)(c)Figure six. SEM photos in the -Irofulven In Vitro joints with thin film interlayer processed at at (a) C for 60 (b) (b) C for ten min, and Figure 6. SEM pictures from the joints with Ti Ti thin film interlayer processed(a) 950 950for 60 min,min,1000 1000 for 10 min, and (c) C for 60 min. min. (c) 1000 1000 forIncreasing the bonding time at 1000 C to 60 min promotes the change Fmoc-Gly-Gly-OH Biological Activity within the thickness Growing the bonding time at 1000 to 60 min promotes the transform within the thickof the layers that compose the interface. This interface is often observed in Figure 6c. The ness of your layers that compose the interface. This interface is often observed in Figure 6c. increase within the bonding time outcomes inside the lower inside the -Ti phase as well as the growth on the The raise within the bonding time final results in the decrease in the -Ti phase along with the development Ti3 Al layer with TiAl particles close to Al2 O3 (Z4 in Figure 6c). on the Ti3Al layer with TiAl particles close to Al2O3 (Z4 in Figure 6c). The confirmation on the phases in the interfaces was conducted by EBSD, which The confirmation from the phases at the interfaces was carried out by EBSD, which alallows Kikuchi patterns of tiny zones to be obtained due to the decreased interaction volume. lows Kikuchi patterns of tiny zones to become obtained on account of the decreased interaction volume. Figure 7 shows EBSD Kikuchi patterns of your joint processed at 1000 C for 60 min. This Figure 7 shows EBSD Kikuchi patterns in the joint processed at 1000 for 60 min. This technique was of paramount value to confirm the presence on the -TiAl intermetallic phase close towards the Al2 O3 base material.strategy was of paramount significance to confirm the presence in the -TiAl intermetallic phase close for the Al2O3 base material.Metals 2021, 11,Table 1. Chemical composition obtained by EDS of your zones in Figure six.9 ofElement (at. ) Table 1. Chemical composition obtained by EDS on the zonesV Figure 6. in Ti Al 1 88.5 ten.3 1.2 Element (at. ) Zone Circumstances 2 88.three 10.3 1.five Ti Al V three 76.five 22.5 1.0 950 /60 min 1 88.five ten.3 1.two 80.3 6.7 10.3 13.0 24 88.3 1.five 35 76.5 1.0 950 C/60 min 65.1 33.722.5 1.2 4 80.3 six.7 13.0 1 86.8 11.six 1.6 5 65.1 33.7 1.2 2 73.three 19.7 7.0 1 86.eight 11.six 1.six 1000 /10 min 86.0 11.919.7 two.1 23 73.three 7.0 C/10 min 1000 34 86.0 2.1 75.0 25.011.9 four 75.0 25.0 1 88.3 11.7 12 88.3 77.1 6.9 11.7 16.0 two 77.1 six.9 16.0 1000 /60 min C/60 min 1000 74.five 25.525.five 33 74.5 44 57.six 57.6 42.442.4 Situations Zone–not detected. –not detected.Doable Phases -TiPossible Phases -Ti2-Ti3Al -Ti -Ti -Ti -Ti3 Al 2-Ti3Al2 -TiAl -Ti -Ti 2 -Ti3 Al -TiAl -Ti -Ti -Ti -Ti -Ti 2-Ti3Al two -Ti3 Al -Ti -Ti -Ti -Ti 2-Ti3Al two -Ti3 Al 2 -Ti3 -TiAl 2-Ti3AlAl -TiAl(b)2(a)(c)Figure 7. (a) SEM 7. (a) SEM pictures of your interface made with Ti thin film processed at 1000for 60 min, (b)(b) EBSD Kikuchi Figure pictures of your interface created with Ti thin film processed at 1000 C for 60 min, EBSD Kikuchi patterns from the grain marked asof the(a) indexed asas 1 in (a)and (c) EBSD Kikuchi patterns of your g.