From the ceramic. Researchers have already been functioning to improve the joining among dissimilar materials by diffusion bonding. Barrena et al. [40] investigated the joining of Ti6Al4V to Al2 O3 by diffusion bonding applying as interlayer an Ag-Cu alloy (72 wt. Ag, 28 wt. Cu) using a thickness of 60 developed by electron beam evaporation. The interface’s microstructure was composed of unique Ti-Cu phases and (Ag), plus the shear tests showed a maximum of 140 MPa obtained at a temperature of 750 C plus a dwell time of 30 min. Yu et al. [10] joined Ti6Al4V to Ti2 SnC working with Cu foil (50 ) as an interlayer in Ar atmosphere performed at a temperature of 750 C through 60 min; a relatively low temperature was permitted resulting from the destabilization of Ti2 SnC that happens under 700 C. The interface’s microstructure is formed mostly by Ti3 Cu4 and TiCu4 , along with the maximum value obtained in the shear tests was Nitrocefin Antibiotic around 86 MPa [10]. Kliauga and Ferrante [41] joined Al2 O3 to AISI304 stainless steel utilizing a industrial Ti sheet using a thickness of 500 by diffusion bonding processed at 800 C during 180 min and at 900 and 1000 C through 120 min beneath a pressure of 15 MPa in vacuum. The authors investigated the interfacial reaction goods of Ti/Al2 O3 . The microstructure characterization of your surface fracture showed that the composition will depend on the temperature and dwell time. The joints made at a temperature of 800 C for 180 min exhibit the Ti3 Al phase in the interface close to the titanium base material, whilst TiAl is observed around the ceramic side. However, for joints obtained at 900 and 1000 C in the course of 120 min, the interface is constituted only by Ti3 Al. In similar perform, Travessa and Ferrante [42] diffusion bonded the exact same base materials and interlayer at 700 C for 120 min, and 800 C for 15 and 120 min. The experiments have been unsuccessful, and no reaction may very well be observed at the interface. Rocha et al. [43] joined pure Ti to Al2 O3 by diffusion bonding at 800 C for 90 min under a pressure of 5 MPa. The characterization in the Ti/Al2 O3 interface identified the presence of TiAl adjacent to alumina and Ti3 Al adjacent to pure Ti. Furthermore, the authors applied galvanic corrosion tests to study the chemical degradation in the interfaces, along with the benefits showed that the corrosion resistance was impaired by the TiAl phase. Through the joining of Ti to Al2 O3 , TiAl intermetallic phase often comes up in zones adjacent to alumina, and also the TiAl/Ti3 Al ratio can boost with the thickness with the Ti interlayer [44]. Even though some operates referred to low temperature bonding (75000 C), the development of new approaches ought to be investigated to lessen the formation of (Ag) in the interface, as would be the case when Ag-based alloys are utilized as interlayers. The presence of (Ag) is detrimental to the FAUC 365 manufacturer service temperature and should be avoided. The objective of the present work consists inside the study with the feasibility of joining Ti6Al4V to Al2 O3 by diffusion bonding applying titanium as interlayer material. Distinct titanium interlayers were investigated: Ti thin films deposited onto Al2 O3 base material by magnetron sputtering and freestanding Ti thin foils. The joints processed working with Ti foilsMetals 2021, 11,3 ofhave a lower processing cost and are more straightforward than those employing thin films obtained by magnetron sputtering. Nevertheless, the lack of adhesion in between the Ti foils and ceramics might make it hard to get sound joints. The Ti interlayer was selected to.